- Manufacturer :
- Chip Quik
- Product Category :
- Solder
- Alloy :
- Sn96.5/Ag3.0/Cu0.5
- Contains Lead :
- NO
- Description/Function :
- Synthetic No-Clean
- Package Type :
- Jar
- Product :
- Solder
- Size :
- 500 g
- Type :
- Paste, No Clean
- Datasheets
- TS991SNL500T3
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Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| TS991AX35T4 | Chip Quik | 27 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (35g syringe) |
| TS991AX500T4 | Chip Quik | 15 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar) |
| TS991SNL35T3 | Chip Quik | 27 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (35g syringe) |
| TS991SNL35T4 | Chip Quik | 27 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe) |
| TS991SNL500T4 | Chip Quik | 15 | Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar) |
